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JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips

JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips
JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips

Large Image :  JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips

Product Details:
Place of Origin: SHENZHEN CN
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN23123
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: $1.5~$6(Prices are determined according to different incoterms and quantities)
Packaging Details: 70~100pcs/carton(According to the customer demand)
Delivery Time: Mold:About 25 Days / Product:7~10 Days
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day

JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips

Description
Compatibility: JEDEC Standard Anti-Static: Yes
Custom: Support Pocket Size: 9.3x9.3x2.22mm
Use: Transport,Storage,Packing Color: Usual Black
Material: MPPO.PPE.ABS.PEI.IDP Hs Code: 39239000
Highlight:

JEDEC trays supplier

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Anti-Static Jedec IC Tray

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CQFP48 Package Chips JEDEC trays

JEEDC IC Tray For CQFP48 Package Chips Meets Environmental And Rohs Requirements

Features:

Hiner-pack was founded in 2013,it is a high-tech enterprise which is integrated Design,R&D,Manufacturing,Sales of IC packaging and testing as well as semiconductive wafer fabrication process in automated handling,carrying,transportation to provide customers turnkey services.
Customized cases : 5G Core Part, Socket, RF Chip, MEMS, Optical Chip

Compatibility:

The JEDEC trays have been specifically designed and manufactured to fit seamlessly with standard handling and testing equipment. They are readily compatible with pick-and-place machines which greatly streamlines the manufacturing process.

Customizability:

While there are standard designs available for JEDEC trays, some manufacturers offer additional customization to accommodate specific device shapes or sizes. This provides flexibility in the manufacturing process and ensures that the trays can be tailored to meet individual requirements.

 Customized Size
Item MaterialABS / PC / MPPO / PPE... acceptable
OEM&ODMYES
Item ColorCan be customized
FeatureDurable;Reusable;Rcofriendly;Biodegradable
SampleA. The free samples: choosen from existing products.
B. customized samples as per your design/demand
MOQ500pcs.
PackingCarton or as per customer's request
Delivery timeUsually 8-10 working days,depends on order quantity
Term of paymentProducts:100% prepayment.
Mold:50% T/T deposit, 50% balance after sample confirmation

 
JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips 0

Technical Parameters:

At Hiner-pack, our customized JEDEC TRAY is designed to 100% meet your IC's specifics, providing tailored protection solutions based on its chip packaging. Our website showcases our range of JEDEC TRAY designs for multiple packaging type, including but not limited to BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and others. We can deliver effective design solutions and effective wafer-level package protection for your products.
Hiner-pack specializes in Research & Application for semiconductor packaging and modified material,which industry chain has integrated the raw materials,mold,the finished product and dust free clean.Our engineering technicians can offer from the mold design,material evaluation,the finished product to the dust free clean in one-stop to provide a full range of solutions,that can effectively save the cost for customers.Our company has skillful and well-trained team in the field of Semiconductor packaging design to work out customer’s requirements,for instance,different temperature,color,ESD property and cleanliness class etc.Experienced product structure engineering team can design various of IC chip,wafer,precision components packaging methods and specifications and other special demands to fit you well.

HN PN.DescriptionExternal Size/mmPocket Size/mmMatrix QTY
HN23123CQFP48322.6x135.9x7.629.3x9.3x2.228X20=160PCS
TYPEBrandFlatnessResistanceService
BGA ICHiner-packMAX 0.76mm1.0x10e4-1.0x10e11ΩAccept OEM,ODM

 
JEDEC Standard Jedec IC Tray Anti-Static For CQFP48 Package Chips 1

Applications:

  • Semiconductor manufacturing and assembly
  • Electronic component testing
  • Shipping and storage of sensitive devices, for instance, integrated circuits (ICs)

Packing and Shipping:

Product Packaging:

  • The custom JEDEC trays will be packaged in a sturdy cardboard box to ensure safe transportation.
  • The trays will be packed securely with bubble wrap or foam to prevent any damage during transit.
  • Each box will contain a specified number of trays based on the customer's order.
  • The box will be clearly labeled with the product name, quantity, and any necessary handling instructions.

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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