Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS

Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design

Product Description:

When it comes to semiconductor devices such as integrated circuits (ICs), safe handling and transportation is crucial to prevent any damage or malfunction. JEDEC trays are specially designed to protect these components during their journey from manufacturing to installation. Here are the key features of JEDEC trays:

JEDEC trays are made based on standard dimensions set by the JEDEC organization. This ensures compatibility across different manufacturers and equipment, making it easier to handle and transport ICs.

JEDEC trays feature a grid-like layout with pockets or cavities designed to securely hold individual components. This minimizes any movement during transport and prevents damage to the ICs. Additionally, some trays come with a cover for extra protection against dust and other debris.

JEDEC trays are designed to be easily stacked on top of each other, making it easier to store and transport multiple ICs at once. This feature also maximizes space utilization in shipping and storage environments.

Many JEDEC trays come with ventilation holes or slots to promote proper airflow during transport. This helps prevent heat buildup, especially for temperature-sensitive devices. By investing in JEDEC trays, you can ensure that your semiconductor devices are safely transported and protected at all times.

Features:

Compatibility:

Our JEDEC trays are specifically designed to fit standard handling and testing equipment, such as pick-and-place machines. This streamlined design makes it easy to incorporate these trays into your existing manufacturing process, saving you time and effort.

Reusability:

Not only are JEDEC trays compatible with standard equipment, but they are also designed for multiple uses. This makes them a cost-effective and environmentally friendly option for semiconductor packaging. Instead of continuously buying new packaging materials, you can reuse these trays multiple times, saving you money and reducing waste.

Customizability:

While our JEDEC trays come in standard designs, some manufacturers may offer customized trays to accommodate specific device shapes or sizes. This means you can get packaging that is tailored to your specific needs, ensuring that your components are protected during handling and transport.

Technical Parameters:

The global requirements for electronic components have led to standardization in the design and shape of JEDEC TRAY. The standard structure of JEDEC TRAY meets international standards, which is not only suitable for carrying electronic components and different packaging IC requirements, but it also matches the requirements of the customer's automatic feeding system. This integration with automation equipment helps achieve easy loading, which ultimately leads to efficient work efficiency.

At Hiner-pack, we provide 100% customized JEDEC TRAY that can solve your IC protection problems according to the type of chip package. We take pride in offering effective design solutions and wafer-level package protection for your products. Our JEDEC TRAY is designed to fit many types of packaging, which includes the common BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and many more.

We offer the most effective design solutions and protection to our customers. Visit our website to explore our unique designs, which cover different types of JEDEC TRAY packaging solutions. Our customized JEDEC TRAY will provide the ultimate design solution to your IC protection problems as it is customized according to your needs and specifications.