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JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP
JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

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Product Details:
Place of Origin: shenzhen,China
Brand Name: Hiner-pack
Certification: ISO 9001 SGS ROHS
Model Number: HN23083
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: TBC
Packaging Details: 80~100pcs/carton
Delivery Time: 1~2 Weeks
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day

JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

Description
Mold No.: HN23083 Cavity Size/mm: 11.93*16.5*4.34
Overall Size/mm: 322.6x135.9x8.3 Matrix Quantity: 8X16=128PCS
Height: 8.3mm Tray Shape: Rectangular
Surface Resistance: 1.0*10e4-1.0*10e11Ω Material: MPPO.PPE.ABS.PEI.IDP
Highlight:

Pocket Size JEDEC Design Tray

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4.34mm JEDEC Design Tray

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Jedec IC Trays for MEMS Device

Pocket Size With 11.93*16.5*4.34mm For MEMS Device Meet JEDEC Design Tray

Product Description:

Our Jedec IC Trays are made of top-quality materials such as MPPO, PPE, ABS, PEI, and IDP, ensuring durability and reliability. These materials are known for their excellent resistance to heat, chemicals, and impact, making them ideal for use in a variety of environments.

 

In conclusion, our Jedec IC Trays are the perfect solution for packaging your electronic components IC chips. With their rugged construction, ESD protection, and lightweight design, they offer superior protection and ease of use. Choose from our selection of cardboard box trays and grid cable trays to find the configuration that best suits your needs.

JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP 0

 

Features:

  • Product Name: Jedec IC Trays
  • Height: 7.62mm
  • Color: Black
  • Tray Weight: 120~200g
  • Tray Features: Stackable
  • IC Type: BGA,QFP,QFN,LGA,PGA
  • Our Jedec IC Trays are perfect for organizing and storing electronic components IC chips such as BGA, QFP, QFN, LGA, and PGA. These trays are stackable, making them easy to store and transport. The trays have a height of 7.62mm and a weight of 120~200g. They come in black and are compatible with Apple Tray Making Machine. Additionally, they can be packaged in cardboard box trays for convenient shipping and handling.
Mold No. HN23083
Cavity Size/mm 11.93*16.5*4.34
Overall Size/mm 322.6x135.9x8.3
Matrix Quantity 8X16=128PCS
Material MPPO.PPE.ABS.PEI.IDP
JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP 1

Applications:

Introducing the JEDEC Tray Series from Hiner-pack, the perfect solution for IC packaging. Our product is made in China and is certified with ISO 9001, SGS, and ROHS. With a minimum order quantity of 500, our product is perfect for businesses of all sizes. Our price is to be confirmed upon inquiry, and our packaging details include 80~100pcs per carton.

 

Overall, the JEDEC Tray Series from Hiner-pack is the perfect solution for businesses looking for a reliable and durable IC packaging solution. Contact us today to place an order!

Support and Services:

Our Jedec IC Trays are designed to provide safe and secure storage and transportation of integrated circuits. Made from high-quality materials, our IC trays offer protection against electrostatic discharge and physical damage. We also offer customized IC trays to meet your specific requirements.

 

Our technical support team is available to provide assistance with tray selection, customization, and usage. We offer comprehensive training programs to ensure that your staff is knowledgeable about the proper handling and storage of IC trays. Additionally, our repair and maintenance services are available to ensure that your IC trays remain in optimal condition.

Contact us today to learn more about our Jedec IC Trays and related technical support and services.

 

Packing and Shipping:

1. Packaging materials
Anti-static materials: use anti-static foam, bags or trays to protect sensitive electronic components from static damage.
Cushioning materials: such as bubble wrap, foam blocks, etc. to provide additional protection against shock and vibration during transportation.
Moisture-proof packaging: Use moisture-proof bags or moisture absorbers to ensure that the product will not be damaged in a humid environment.

 

2. Pallet and Container Selection
Use of JEDEC pallets: For electronic components, use pallets that comply with JEDEC standards to ensure compatibility and safety.
Stacking capability: Select stackable pallets and containers to save storage space and improve transportation efficiency.

 

3. Mode of transportation
Selection of appropriate mode of transportation: Choose land, sea or air transportation according to the urgency of the product and the target market.
Carrier selection: Choose reputable carriers and make sure they have the expertise to handle electronic products.

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Ms. Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)