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Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

—— 本間宏紀

이것은 귀 회사와의 두 번째 합작입니다.상품 가격 너무 좋아요.다시 올게요, 다음번 합작을 기대합니다!

—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards
Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards

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Product Details:
Place of Origin: shenzhen,China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN23099
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30cm
Delivery Time: 1~2 Weeks
Payment Terms: T/T
Supply Ability: 2000PCS/Day

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards

Description
Mold No.: HN23099 Cavity Size/mm: 27.3*27.3*1.66
Overall Size/mm: 322.6x135.9x12.19 Matrix Quantity: 4X9=36PCS
Material: MPPO/PPE Labeling Options: Barcode Or Custom Labeling
Packing Level: Transport Package Injection Mold: Lead Time 20~25Days
Tray Weight: 0.170 Kg Selling Units: Single Item
Manufacturer: SHENZHEN Peculiarity: Permanent Antistatic
Quality Assurance: Delivery Guarantee, Reliable Quality Compatibility: JEDEC Standard ICs
Tray Shape: Rectangular
Highlight:

Shipping JEDEC Standard TRAY

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TSSOP Packaged IC TRAY

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JEDEC Standards IC TRAY

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY

Fully Compliant With JEDEC Standards And Equipment

 

Manufacturer Factory Direct Sale Full Scales ESD SMT Tray Electronic Packaging Tray 100% Original Injection Customized Moulding

 

Why choose Hiner-pack to design and produce ESD SMT electronic packaging trays for you?
 

1. Choosing the right supplier
Hiner-pack is a company specializing in electronic packaging and tray manufacturing, with 13 years of experience in the industry, rich experience in R&D and well-equipped production facilities.

Hiner-pack has 13 years of experience in R&D and production facilities, as well as ISO certification and a good reputation in the market to ensure the quality of its products.
 

2. Product specifications and customization
Full-size ESD trays: Confirm that the product size, material (e.g., antistatic polypropylene) and design meet your specific needs.

Custom molding: Hiner-pack offers customization services, including colors, logos and specific shape designs. Meet your branding and design needs.
 

3. Quality Assurance
100% Original Material: Ensure that 100% original injection molding materials are used for the trays to prevent inferior materials from affecting use.
Sample testing: We can provide different kinds of samples for testing at the same time to verify the anti-static performance and durability or other testing conditions.

 

4. Price and delivery lead time
Inquiry: We can design and process the molds, which has reduced some cost for customers. In addition, we have more than 10 years experience in pallet manufacturing, which ensures customers have no worries.
Delivery time: Confirm the production cycle and delivery time to ensure that your production schedule is met.

 

5. After-sales service
Customer support: If there is a quality problem, our factory support includes return and exchange, technical support and other services.
Long-term cooperation: Consider establishing a long-term relationship with Hiner-pack to make subsequent purchases more convenient.

 

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards 0

 

Mold No. HN23099
Cavity Size/mm 27.3*27.3*1.66
Overall Size/mm 322.6x135.9x12.19
Matrix Quantity 4X9=36PCS
Material MPPO/PPE

 

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards 1

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Ms. Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)