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Product Details:
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| Mold No.: | HN23067 | Cavity Size/mm: | 8.3*9.3*1.14 |
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| Overall Dimension/mm: | 322.6x135.9x12.19 | Material: | MPPO/PPE |
| Matrix Quantity: | 9X20=180PCS | Color: | Black(According To Customer Needs） |
| Application: | IC Packaging | Clean Class: | General And Ultrasonic Cleaning |
| Tray Features: | Stackable | Peculiarity: | Permanent Antistatic |
| Selling Units: | Single Item | Durable: | Yes |
| Country Of Origin: | SHENZHEN | Shaping Mode: | Aluminum Alloy Injection Mould |
| Highlight: | IC Storage Packaging JEDEC Tray,ESD JEDEC Chip Tray,Antistatic JEDEC Chip Tray |
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ESD ROHS Black Antistatic PPE MPPO IC Storage Packaging JEDEC Chip Tray
ESD High Temperature IC Chip Tray Electronic Component Tray
JEDEC standard injection molded trays are mainly used for anti-static IC storage, especially in the transportation and storage of PCB electronic components. These trays have the following features and advantages:
1. Application of high-performance materials
New material development: more and more high-performance materials (such as PE1, PES, etc.) are used to manufacture JEDEC trays to improve high temperature resistance, chemical resistance and anti-static properties.
2. Automated production needs
Automation compatibility:With the electronics manufacturing industry to automation transition, JEDEC tray design is increasingly focusing on compatibility with automation equipment to improve production efficiency.
3. Environmental Protection and Sustainability
Recyclable Materials:Manufacturers are gradually adopting recyclable and environmentally friendly materials to meet the requirements of sustainable development and reduce the impact on the environment.
4. Miniaturization and High Density Storage
Miniaturization Trend:As electronic components become smaller and smaller in size, the design of trays also puts forward higher requirements, promoting miniaturization and high-density storage solutions.
5.Customization Requirements
Customized Solutions:Customers are looking for customized solutions for their pallets. Personalized solutions: Customers are increasingly demanding customization of pallets to fit specific products and production processes.
6. Globalized Supply Chain
International Standardization:As globalization advances, the standardized design of JEDEC pallets enables them to better adapt to the international market and improve the efficiency of the supply chain.
| Mold No. | HN23067 |
| Cavity Size/mm | 8.3*9.3*1.14 |
| Overall Dimension/mm | 322.6x135.9x12.19 |
| Material | MPPO/PPE |
| Matrix Quantity | 9X20=180PCS |
| Color | black(According to customer needs) |
Customer FAQ
Question 1: How many kinds of injection molding products do you produce?
A: Mainly consumer electronics, medical devices, auto parts, digital electronics, computer parts, semiconductors, labor protection and other products, welcome to inquire!
Question 2: What are your factory certificates?
A: Passed ISO9001 ITF16949 ISO14001 SGS, ROHS, TUV, CE and so on.
Question 3:What are your mold products?
Answer: Plastic injection molds, injection molded products, blister trays, wafer turnover boxes and so on.
Question 3: How many materials are available for chip trays?
Answer: ABS/PPO/PPE/LCP/PS/PC, temperature resistance range 80,120,150,270°, we can design different temperature resistance and anti-static trays.
Q4: What types of pallets do you produce?
A: We offer JEDEC-compliant IC trays for semiconductor and electronic component packaging, as well as wafers, chip trays, and other irregular customized trays for various precision parts.
Q5: What are your tray packaging types?
A: BGA, QFN, QFN: BGA, QFN, QFP, BGA, TQFP, LQFP, SO, TSOP, PLCC, LC, and many other package forms.
Contact Person: Ms. Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
