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Product Details:
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| Material: | PC | Color: | Black |
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| Matrix QTY: | 36*18=648PCS | Place Of Origin: | CHINA |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Clean Class: | General And Ultrasonic Cleaning |
| Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method: | Injection Moulding |
| Highlight: | SGS Bare Die Tray,4 Inch Bare Die Tray,Bare Die 4 Inch Waffle Pack |
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SGS Customized 4 Inch PC Waffle pack Bare Die Tray 648PCS Storage
The waffle pack is the carrier of semiconductor chip packaging, mainly used for inspection, storage and transportation. Hiner-pack offers a wide selection of 4" waffle pack, covers and accessories,which can meet your specific bare mold, chip scale and wafer scale packaging shipping and processing needs. They are available in various pocket sizes and depths. The products are designed and manufactured to provide reliable protection while minimizing your shipping and storage costs.
The Details of the HN22025 Waffle Pack
Compared to traditional packaging, the service life of waffle pack is five to seven times longer. At the same time, it is made of PC material. The product is not only small size and light weight, which is very suitable for the transportation of small naked mold. For specific 1.45*2.85*0.88 mm pocket size, we design the most reasonable 36*18 matrix. This design can accommodate the maximum amount of customer products.
In addition, the warpage of the product is strictly controlled below 0.3mm. From raw material selection, mold manufacturing, production to packaging, all steps and operations have strict quality control. IC trays have different manufacturing formats to accommodate different sizes of IC chips. We can also customize to suit different sizes of products according to customer needs.
| Outline Line Size | 101.6*101.6*5.5mm | Brand | Hiner-pack |
| Model | HN22025 | Package Type | Die |
| Cavity Size | 1.45*2.85*0.88 | Matrix QTY | 36*18=648PCS |
| Material | PC | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS ISO9001 |
The Application of HN22025 Chip Tray
IC Packaging Delivery Systems Embedded Systems
Micro and Anon Systems Micro and Nano Systems
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Our Service
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
FAQ
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
