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Product Details:
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| Material: | PC PP | Temperature: | 80°C |
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| Including: | Base+Cover+Clip | Color: | Black |
| Matrix QTY: | 11x13=143PCS | Surface Resistance: | 1.0x10E4~1.0x10E11Ω |
| Clean Class: | General And Ultrasonic Cleaning | Incoterms: | EXW,FOB,CIF,DDU,DDP |
| Highlight: | PC Waffle Pack Tray,PP Waffle Pack Tray,PP die waffle pack |
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Custom Optoelectronic Chip Waffle Pack Tray Cover Clip PC PP Material
Custom Optoelectronic Chip Waffle Pack Tray Cover And Clip
Waffle pack packaging needs to match the cover and clamps together for the best effect, can effectively fix the product placement position, even if there is shaking in the transportation can still stabilize the product is not affected by any, widely used in the packaging of wafer particles after cutting and small size electronic components.
Waffle Pack is a form of packaging designed for use with parts that are either very small or unusual in shape. Waffle pack are embossed or pocketed trays, typically made of plastic, that resemble a breakfast waffle (hence the name). The waffle packs are loaded using pick and place equipment so that the "inside" of each pocket contains a part or component. Once loaded - the parts are covered with anti-static paper, and then a foam-covered crown holds the parts in place, and finally, a lid secures the waffle package together.
Product Feature
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4.After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity
| Outline Line Size | 101.6*101.6*7.11mm | Brand | Hiner-pack |
| Model | HN21068 | Package Type | IC |
| Cavity Size | 5.69*4.28*1.3mm | Matrix QTY | 11*13=143PCS |
| Material | PC | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Product Application
IC, Electronic component, Semiconductor, Micro and Nano systems and Sensor IC etc
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
For more information, please contact our sales department
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
