|
Product Details:
|
| Material: | PC | Color: | Black |
|---|---|---|---|
| Property: | ESD | Design: | Standard |
| Size: | 4 Inch | Surface Resistance: | 1.0x10E4~1.0x10E11Ω |
| Clean Class: | General And Ultrasonic Cleaning | Matrix: | 10*16=160PCS |
| Injection Mold: | Lead Time 20~25Days | Molding Method: | Injection Moulding |
| Highlight: | SGS IC Chip Tray,ESD IC Chip Tray,waffle pack chip trays |
||
Transshipment Storage ESD IC Chip Tray
Factory Made Transshipment And Storage Chip Tray With Excellent Flatness
Why do we need to control the flatness of the tray?
Flatness control is directly related to the entire tray is flat and level, if the complete tray is not smooth, when after loading all the chips or electronic components, is not suitable for automation equipment store and pick up, not only on the automatic production efficiency greatly,
Flat tray also can save the storage space after the product packaging, The product transportation process space reduction at the same time also saves freight;
The most critical flat tray will not loosen the product after carrying the product. If the product loosens too much area in the tray, it is easy to cause damage to the product and the electronic chip, and there is a risk of scratching the product.
Our Advantages
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years’ex perience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
Service
We offer ESD total Solution to Customer, Many other related product available if needed.
OEM is welcomed or design as customer request.
The best & professional sale services.
Honest but competitive price and Quality assured quotation.
100% QC inspection before shipment.
Product Application
Electronic component Semiconductor Embedded System Display technology
Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply
Packaging
Packaging Details:Packing according to customer's specified size
| Technical Data Ref. | ||||
| Base Information | Material | Color | ESD | Pocket Size |
| PC | Black | Yes | 3.5*6.6*2.5mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable;Reusable;Rcofriendly;Biodegradable | |||
| Sample | A. The free samples: choosen from existing products. | |||
| B. customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
