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Product Details:
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Material: | ABS.PC.PPE.MPPO...etc | Color: | Black.Red.Yellow.Green.White..etc |
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Property: | ESD,Non-ESD | Design: | Standard And Non-standard |
Size: | All Kinds Of | Surface Resistance: | 1.0x10E4~1.0x10E11Ω |
Clean Class: | General And Ultrasonic Cleaning | Incoterms: | EXW,FOB,CIF,DDU,DDP |
Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method: | Injection Moulding |
Highlight: | ESD Waffle Electronic Components Tray,SGS Electronic Components Tray,sgs ESD electronic tray |
ESD Waffle Pack Electronic Components Tray
Durable Antistatic ABS Non-Standard Waffle Pack With Different Size Can Be Customized For Optoelectronic Components
As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.
Advanges
1. More than 10 years export experience
2. With professional engineers and efficient management
3. Short delivery time and good quality
4. Support small batch production in the first batch
5. Professional sales within 24 hours efficient reply
6. Factory has ISO certification, and the products comply to RoHS standard.
7. Our products are exported to the United States, Germany, UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, service or cost performance has been well recognized
Outline Size | Material | Surface Resistance | Service | Flatness | Color |
2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
Provide professional design and packaging for your products |
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455