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ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance

  • ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance
  • ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance
  • ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance
  • ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance
ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance
Product Details:
Place of Origin: Shenzhen China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN2099 Lid
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.28~0.55
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: 5000PCS~6000PCS per day
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Detailed Product Description
Property: ESD Color: Black
Material: PC Size: 101.5*101.5mm
Height: 4.8mm Use: Transport,Storage,Packing
HS Code: 39239000 Surface Resistance: 1.0x10E4~1.0x10E11Ω
Highlight:

ESD Waffle Tray Packaging Lids

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4inch Waffle Tray Packaging Lids

,

ISO Waffle Tray Pack Lids

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance

 

High Temperature Durable 4 Inch Black Waffle Pack Lids

 

Character Reference

 

The cover and insert materials are generally made of industry standard anti-static Tyvek paper and ABS or PC.

Manual placement, dislocation and/or squeezing of the Tyvek paper is avoided when loading the waffle package

Seal each individual pallet pocket evenly

Compensate for normal waffle packaging cover/tray warping conditions, resulting in notching, fixed product elements do not move

Save a lot of scrap costs caused by yield loss, rework and mold component movement.

 

Advantages

 

1. Suitable for components or devices daily turnover or long-distance freight.
2. Can be stacked more layers;
3. Can be washed at high temperature;
4. Plastic waterproof, moisture-proof, improve the storage time of components;
5. No extrusion and breakage, Better protection components;
6. Reusable, quality assurance.

 

Application

 

Wafer Dicing

Wafer Sorting

Wafer / Die Pick and place

Wafer/ Die Shipping

Usage Packaging of Electronic Components,Optical device,
Feature ESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
Material PC.ABS...etc
Color Black.Red.Yellow.Green.White and custom color
Size Customized size, rectangle,circle shape
Mold type Injection Mold
Design Original sample or we can create the designs
Packing By Carton
Sample Sample time: after draft confirmed and payment arranged
Sample charge: 1. Free for stock samples
2. Custom Tray negotiated
Lead Time 5-7 Working days
The exact time should according to the ordered quantity

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance 0

FAQ

 

Q1: Are you a manufacturer?
Ans:Yes, We have ISO 9000 Quality Management System.

Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity and size normally.


Q3: How long you could prepare samples?
Ans:Normally 3 days. If customized one, open new mold 25~30days around.

Q4: How about batch order production?
Ans: Normally 5-8days or so.

Q5:Do you inspect the finished products?
Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance 1

ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)

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